| Commit message (Collapse) | Author | Age |
|---|
| |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
Add necessary default platform data support needed for TMU driver. The
supplied dt/non-dt values are tested for origen exynos4210 and smdk exynos5250
platforms and only compile tested for exynos4412.
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: jonghwa lee <jonghwa3.lee@samsung.com>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
This code added creates a link between temperature sensors, linux thermal
framework and cooling devices for samsung exynos platform. This layer
monitors the temperature from the sensor and informs the generic thermal
layer to take the necessary cooling action.
[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
Insert exynos5 TMU sensor changes into the thermal driver. Some exynos4
changes are made generic for exynos series.
[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: SangWook Ju <sw.ju@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c. The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms. As a proof of concept, we have
drivers for the following platforms using this mechanism now:
* Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
* Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)
There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.
Brief Description:
1) The generic cooling devices code is placed inside driver/thermal/*
as placing inside acpi folder will need un-necessary enabling of acpi
code. This code is architecture independent.
2) This patchset adds generic cpu cooling low level implementation
through frequency clipping. In future, other cpu related cooling
devices may be added here. An ACPI version of this already exists
(drivers/acpi/processor_thermal.c) .But this will be useful for
platforms like ARM using the generic thermal interface along with the
generic cpu cooling devices. The cooling device registration API's
return cooling device pointers which can be easily binded with the
thermal zone trip points. The important APIs exposed are,
a) struct thermal_cooling_device *cpufreq_cooling_register(
struct cpumask *clip_cpus)
b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
3) Samsung exynos platform thermal implementation is done using the
generic cpu cooling APIs and the new trip type. The temperature sensor
driver present in the hwmon folder(registered as hwmon driver) is moved
to thermal folder and registered as a thermal driver.
A simple data/control flow diagrams is shown below,
Core Linux thermal <-----> Exynos thermal interface <----- Temperature Sensor
| |
\|/ |
Cpufreq cooling device <---------------
TODO:
*Will send the DT enablement patches later after the driver is merged.
This patch:
Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.
[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
| |
|
|
|
| |
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
| |
|
|
|
|
|
|
|
|
|
|
| |
The type parameter in thermal_zone_device_register and
thermal_cooling_device_register can be NULL, indicating that no sysfs attribute
for the type should be created. Only call strlen() and strcpy() on type if it is
not NULL.
This patch addresses Coverity #102180 and #102182: Dereference before null check
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
| |
This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Len Brown <len.brown@intel.com>
Cc: Joe Perches <joe@perches.com>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Magnus Damm <magnus.damm@gmail.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
| |
temp_crit.name and temp_input.name have a length of 16 bytes. Using
THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in
out-of-bounds memory accesses. Replace it with sizeof().
Addresses Coverity #115679
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Cc: Len Brown <lenb@kernel.org>
Cc: "Brown, Len" <len.brown@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
|
| |
|
|
|
|
|
|
|
|
|
|
|
| |
we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.
But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
|
| |
|
|
|
|
|
|
|
|
| |
Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.
With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
of all its instances.
Note that, currently, the cooling device is set to the deepest
cooling state required.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
|
| |
|
|
|
|
|
|
|
|
| |
List thermal_instance in thermal_cooling_device so that
cooling device can know the cooling state requirement
of all the thermal instances.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
|
| |
|
|
|
|
|
|
|
|
|
|
| |
thermal_instance should be referenced by both thermal zone devices
and thermal cooling devices.
Rename thermal_instance.node to thermal_instance.tz_node in this patch
and thermal_instanace.cdev_node will be introduced in next patch.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
|
| |
|
|
|
|
|
|
|
|
|
|
| |
Rename thermal_zone_device.cooling_devices
to thermal_zone_device.thermal_instances
thermal_zone_device.cooling_devices is not accurate
as this is a list for thermal instances, rather than cooling devices.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
|
| |
|
|
|
|
|
|
|
|
|
|
| |
This struct is used to describe the behavior for a thermal
cooling device on a certain trip point for a certain thremal zone.
thermal_cooling_device_instance is not accurate, as a cooling device
can be used for more than one trip point in one thermal zone device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
This function is used to update the cooling state of
all the cooling devices that are bound to an active trip point.
This will be used for passive cooling as well, in the future patches.
as both active and passive cooling can share the same algorithm,
which is
1. if the temperature is higher than a trip point,
a. if the trend is THERMAL_TREND_RAISING, use higher cooling
state for this trip point
b. if the trend is THERMAL_TREND_DROPPING, use lower cooling
state for this trip point
2. if the temperature is lower than a trip point, use lower
cooling state for this trip point.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
|
| |
|
|
|
|
|
|
|
| |
Remove tc1/tc2 in generic thermal layer.
.get_trend() callback starts to take effect from this patch.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
According to ACPI spec, tc1 and tc2 are used by OSPM
to anticipate the temperature trends.
We introduced the same concept to the generic thermal layer
for passive cooling, but now it seems that these values
are hard to be used on other platforms.
So We introduce .get_trend() as a more general solution.
For the platform thermal drivers that have their own way to
anticipate the temperature trends, they should provide
their own .get_trend() callback.
Or else, we will calculate the temperature trends by simply
comparing the current temperature and the cached previous
temperature reading.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
|
| |
|
|
|
|
|
|
|
| |
set upper and lower limits when binding
a thermal cooling device to a thermal zone device.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
As the active cooling devices can have multiple cooling states,
we may want only several cooling states for a certain trip point,
and other cooling states for other active trip points.
To do this, we should be able to describe the cooling device
behavior for a certain trip point, rather than for the entire thermal zone.
And when updating thermal zone, we need to check the upper and lower limit
to make sure the cooling device is set to the proper cooling state.
Note that this patch will not bring any different behavior as
upper limit is set to max_state and lower limit is set to 0
in this patch, for now.
Next patch will set these to real values.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
|
| |
|
|
|
|
|
|
|
| |
This is because general active cooling devices, like fans,
may have multiple speeds, which can be mapped to different cooling states.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
|
| | |
|
| |\
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| | |
Pull OLPC platform updates from Andres Salomon:
"These move the OLPC Embedded Controller driver out of
arch/x86/platform and into drivers/platform/olpc.
OLPC machines are now ARM-based (which means lots of x86 and ARM
changes), but are typically pretty self-contained.. so it makes more
sense to go through a separate OLPC tree after getting the appropriate
review/ACKs."
* 'for-linus-3.6' of git://dev.laptop.org/users/dilinger/linux-olpc:
x86: OLPC: move s/r-related EC cmds to EC driver
Platform: OLPC: move global variables into priv struct
Platform: OLPC: move debugfs support from x86 EC driver
x86: OLPC: switch over to using new EC driver on x86
Platform: OLPC: add a suspended flag to the EC driver
Platform: OLPC: turn EC driver into a platform_driver
Platform: OLPC: allow EC cmd to be overridden, and create a workqueue to call it
drivers: OLPC: update various drivers to include olpc-ec.h
Platform: OLPC: add a stub to drivers/platform/ for the OLPC EC driver
|
| | |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| | |
The new EC driver calls platform-specific suspend and resume hooks; run
XO-1-specific EC commands from there, rather than deep in s/r code. If we
attempt to run EC commands after the new EC driver has suspended, it is
refused by the ec->suspended checks.
Signed-off-by: Andres Salomon <dilinger@queued.net>
Acked-by: Paul Fox <pgf@laptop.org>
Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
|
| | |
| |
| |
| |
| |
| |
| |
| |
| | |
Populate olpc_ec_priv with variables that were previously global. This
makes things a tad bit clearer, IMO.
Signed-off-by: Andres Salomon <dilinger@queued.net>
Acked-by: Paul Fox <pgf@laptop.org>
Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
|
| | |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| | |
There's nothing about the debugfs interface for the EC driver that is
architecture-specific, so move it into the arch-independent driver.
The code is mostly unchanged with the exception of renamed variables, coding
style changes, and API updates.
Signed-off-by: Andres Salomon <dilinger@queued.net>
Acked-by: Paul Fox <pgf@laptop.org>
Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
|
| | |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| | |
This uses the new EC driver framework in drivers/platform/olpc. The
XO-1 and XO-1.5-specific code is still in arch/x86, but the generic stuff
(including a new workqueue; no more running EC commands with IRQs disabled!)
can be shared with other architectures.
Signed-off-by: Andres Salomon <dilinger@queued.net>
Acked-by: Paul Fox <pgf@laptop.org>
Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
|
| | |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| | |
A problem we've noticed on XO-1.75 is when we suspend in the middle of
an EC command. Don't allow that.
In the process, create a private object for the generic EC driver to use;
we have a framework for passing around a struct, use that rather than a
proliferation of global variables.
Signed-off-by: Andres Salomon <dilinger@queued.net>
Acked-by: Paul Fox <pgf@laptop.org>
Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
|
| | |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| | |
The 1.75-based OLPC EC driver already does this; let's do it for all EC
drivers. This gives us nice suspend/resume hooks, amongst other things.
We want to run the EC's suspend hooks later than other drivers (which may
be setting wakeup masks or be running EC commands). We also want to run
the EC's resume hooks earlier than other drivers (which may want to run EC
commands).
Signed-off-by: Andres Salomon <dilinger@queued.net>
Acked-by: Paul Fox <pgf@laptop.org>
Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
|
| | |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| | |
This provides a new API allows different OLPC architectures to override the
EC driver. x86 and ARM OLPC machines use completely different EC backends.
The olpc_ec_cmd is synchronous, and waits for the workqueue to send the
command to the EC. Multiple callers can run olpc_ec_cmd() at once, and
they will by serialized and sleep while only one executes on the EC at a time.
We don't provide an unregister function, as that doesn't make sense within
the context of OLPC machines - there's only ever 1 EC, it's critical to
functionality, and it certainly not hotpluggable.
Signed-off-by: Andres Salomon <dilinger@queued.net>
Acked-by: Paul Fox <pgf@laptop.org>
Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
|
| | |
| |
| |
| |
| |
| |
| |
| |
| | |
Switch over to using olpc-ec.h in multiple steps, so as not to break builds.
This covers every driver that calls olpc_ec_cmd().
Signed-off-by: Andres Salomon <dilinger@queued.net>
Acked-by: Paul Fox <pgf@laptop.org>
Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
|
| | |
| |
| |
| |
| |
| |
| |
| |
| |
| |
| | |
The OLPC EC driver has outgrown arch/x86/platform/. It's time to both
share common code amongst different architectures, as well as move it out
of arch/x86/. The XO-1.75 is ARM-based, and the EC driver shares a lot of
code with the x86 code.
Signed-off-by: Andres Salomon <dilinger@queued.net>
Acked-by: Paul Fox <pgf@laptop.org>
Reviewed-by: Thomas Gleixner <tglx@linutronix.de>
|
| |\ \
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | |
| | | |
Pull arm-soc Marvell Orion device-tree updates from Olof Johansson:
"This contains a set of device-tree conversions for Marvell Orion
platforms that were staged early but took a few tries to get the
branch into a format where it was suitable for us to pick up.
Given that most people working on these platforms are hobbyists with
limited time, we were a bit more flexible with merging it even though
it came in late."
* tag 'dt2' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (21 commits)
ARM: Kirkwood: Replace mrvl with marvell
ARM: Kirkwood: Describe GoFlex Net LEDs and SATA in DT.
ARM: Kirkwood: Describe Dreamplug LEDs in DT.
ARM: Kirkwood: Describe iConnects LEDs in DT.
ARM: Kirkwood: Describe iConnects temperature sensor in DT.
ARM: Kirkwood: Describe IB62x0 LEDs in DT.
ARM: Kirkwood: Describe IB62x0 gpio-keys in DT.
ARM: Kirkwood: Describe DNS32? gpio-keys in DT.
ARM: Kirkwood: Move common portions into a kirkwood-dnskw.dtsi
ARM: Kirkwood: Replace DNS-320/DNS-325 leds with dt bindings
ARM: Kirkwood: Describe DNS325 temperature sensor in DT.
ARM: Kirkwood: Use DT to configure SATA device.
ARM: kirkwood: use devicetree for SPI on dreamplug
ARM: kirkwood: Add LS-XHL and LS-CHLv2 support
ARM: Kirkwood: Initial DTS support for Kirkwood GoFlex Net
ARM: Kirkwood: Add basic device tree support for QNAP TS219.
ATA: sata_mv: Add device tree support
ARM: Orion: DTify the watchdog timer.
ARM: Orion: Add arch support needed for I2C via DT.
ARM: kirkwood: use devicetree for orion-spi
...
Conflicts:
drivers/watchdog/orion_wdt.c
|
| | |\ \
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | | |
* marvell/dt: (41 commits)
ARM: Kirkwood: Replace mrvl with marvell
ARM: Kirkwood: Describe GoFlex Net LEDs and SATA in DT.
ARM: Kirkwood: Describe Dreamplug LEDs in DT.
ARM: Kirkwood: Describe iConnects LEDs in DT.
ARM: Kirkwood: Describe iConnects temperature sensor in DT.
ARM: Kirkwood: Describe IB62x0 LEDs in DT.
ARM: Kirkwood: Describe IB62x0 gpio-keys in DT.
ARM: Kirkwood: Describe DNS32? gpio-keys in DT.
ARM: Kirkwood: Move common portions into a kirkwood-dnskw.dtsi
ARM: Kirkwood: Replace DNS-320/DNS-325 leds with dt bindings
ARM: Kirkwood: Describe DNS325 temperature sensor in DT.
ARM: Kirkwood: Use DT to configure SATA device.
ARM: kirkwood: use devicetree for SPI on dreamplug
ARM: kirkwood: Add LS-XHL and LS-CHLv2 support
ARM: Kirkwood: Initial DTS support for Kirkwood GoFlex Net
ARM: Kirkwood: Add basic device tree support for QNAP TS219.
ATA: sata_mv: Add device tree support
ARM: Orion: DTify the watchdog timer.
ARM: Orion: Add arch support needed for I2C via DT.
ARM: kirkwood: use devicetree for orion-spi
...
|
| | | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | | |
It has been decided to use marvell, not mrvl, in the compatibility
property. Search & replace.
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
|
| | | | |
| | | |
| | | |
| | | |
| | | | |
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Tested-by: Josh Coombs <josh.coombs@gmail.com>
|
| | | | |
| | | |
| | | |
| | | | |
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
|
| | | | |
| | | |
| | | |
| | | | |
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
|
| | | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | | |
Now that we have I2C support in DT, describe the LM63 in
the DT file for the iConnect.
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
|
| | | | |
| | | |
| | | |
| | | |
| | | | |
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Tested-by: Simon Baatz <gmbnomis@gmail.com>
|
| | | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | | |
Now that the GPIO controllers have been converted over to DT,
described the gpio-keys in DT.
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Tested-by: Simon Baatz <gmbnomis@gmail.com>
|
| | | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | | |
Move description of GPIO keys on both the DNS320 and DNS325 into DT.
Signed-off-by: Jamie Lentin <jm@lentin.co.uk>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
|
| | | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | | |
A lot of device setup is shared between DNS-320 and DNS-325, move the
definitions into a common include.
Signed-off-by: Jamie Lentin <jm@lentin.co.uk>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
|
| | | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | | |
Replace code in board-dnskw with the equivalent devicetree bindings.
Signed-off-by: Jamie Lentin <jm@lentin.co.uk>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
|
| | | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | | |
Now that we have I2C support in DT, describe the LM75 in
the DT file for the DNS325.
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Jamie Lentin <jm@lentin.co.uk>
|
| | | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | | |
Convert boards using DT, but the old way of configuring SATA to now
use properties in there DT file.
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Tested-by: Simon Baatz <gmbnomis@gmail.com>
|
| | | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | | |
Use the device tree for the SPI driver and partition layout.
Signed-off-by: Michael Walle <michael@walle.cc>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
|
| | | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | | |
Add support for Buffalo Linkstation LS-XHL and LS-CHLv2 using the device
tree where possible.
Signed-off-by: Michael Walle <michael@walle.cc>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
|
| | | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | |
| | | | |
This patch supplies the necessary DTS and supporting files to boot up
a Seagate GoFlex Net with 3.5.0-rc3.
Signed-off-by: Joshua Coombs <josh.coombs@gmail.com>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
|
